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 MC74HC1G02 Single 2-Input NOR Gate
The MC74HC1G02 is a high-speed CMOS 2-input NOR gate fabricated with silicon gate CMOS technology. The internal circuit is composed of multiple stages, including a buffer output which provides high noise immunity and stable output. The MC74HC1G02 output drive current is 1/2 compared to the MC74HC series.
* * * * * *
High Speed: tPD = 7 ns (Typ) at VCC = 5 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25_C High Noise Immunity Balanced Propagation Delays (tPLH = tPHL) Symmetrical Output Impedance (IOH = IOL = 2 mA) Chip Complexity: FET = 40
5
http://onsemi.com MARKING DIAGRAMS
1 SC70-5/SC-88A/SOT-353 DF SUFFIX CASE 419A
H3d
Pin 1
IN B
1
5
VCC 5
IN A
2
1 SOT23-5/TSOP-5/SC59-5 DT SUFFIX CASE 483 d = Date Code
H3d
GND
3
4
OUT Y
Pin 1
Figure 1. Pinout (Top View) PIN ASSIGNMENT
IN A IN B 1 OUT Y 1 2 IN B IN A GND OUT Y VCC
Figure 2. Logic Symbol
3 4 5
FUNCTION TABLE
Inputs A L L H H B L H L H Output Y H L L L
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2001
1
October, 2001 - Rev. 7
Publication Order Number: MC74HC1G02/D
MC74HC1G02
MAXIMUM RATINGS
Symbol VCC VIN VOUT IIK IOK IOUT ICC TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Thermal Resistance Power Dissipation in Still Air at 85_C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) SC70-5/SC-88A (Note 1) TSOP-5 SC70-5/SC-88A TSOP-5 Parameter Value *0.5 to )7.0 *0.5 to VCC )0.5 *0.5 to VCC )0.5 $20 $20 $12.5 $25 *65 to )150 260 )150 350 230 150 200 Level 1 UL 94 V-0 @ 0.125 in u2000 u200 N/A V Unit V V V mA mA mA mA _C _C _C _C/W mW
ILATCH-UP Latch-Up Performance Above VCC and Below GND at 125_C (Note 5) $500 mA Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute-maximum-rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 20 ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN VOUT TA tr , tf DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature Range Input Rise and Fall Time VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V Parameter Min 2.0 0.0 0.0 *55 0 0 0 0 Max 6.0 VCC VCC )125 1000 600 500 400 Unit V V V _C ns
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES
Junction Temperature C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0
FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130_C TJ = 120_C TJ = 100_C TJ = 110_C TJ = 90_C TJ = 80_C 100 TIME, YEARS
1 1 10 1000
Figure 3. Failure Rate vs. Time Junction Temperature
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MC74HC1G02
DC ELECTRICAL CHARACTERISTICS
VCC Symbol VIH Parameter Minimum High-Level Input Voltage Test Conditions (V) 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 VIN = VIH or VIL IOH = -20 mA 2.0 3.0 4.5 6.0 4.5 6.0 2.0 3.0 4.5 6.0 4.5 6.0 6.0 6.0 1.9 2.9 4.4 5.9 4.18 5.68 2.0 3.0 4.5 6.0 4.31 5.80 0.0 0.0 0.0 0.0 0.17 0.18 0.1 0.1 0.1 0.1 0.26 0.26 $0.1 1.0 Min 1.5 2.1 3.15 4.20 0.5 0.9 1.35 1.80 1.9 2.9 4.4 5.9 4.13 5.63 0.1 0.1 0.1 0.1 0.33 0.33 $1.0 10 TA = 25_C Typ Max TA v 85_C Min 1.5 2.1 3.15 4.20 0.5 0.9 1.35 1.80 1.9 2.9 4.4 5.9 4.08 5.58 0.1 0.1 0.1 0.1 0.40 0.40 $1.0 40 mA mA V Max *55_C v TA v 125_C Min 1.5 2.1 3.15 4.20 0.5 0.9 1.35 1.80 Max Unit V
VIL
Maximum Low-Level Input Voltage
V
VOH
Minimum High-Level Output Voltage VIN = VIH or VIL
V
VIN = VIH or VIL IOH = -2 mA IOH = -2.6 mA VOL Maximum Low-Level Output Voltage VIN = VIH or VIL VIN = VIH or VIL IOL = 20 mA
VIN = VIH or VIL IOL = 2 mA IOL = 2.6 mA IIN ICC Maximum Input Leakage Current Maximum Quiescent Supply Current VIN = 6.0 V or GND VIN = VCC or GND
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 6.0 ns)
TA = 25_C Symbol tPLH, tPHL Parameter Test Conditions Min Typ 3.5 Max 15 Maximum Propagation Delay Delay, Input A or B to Y VCC = 5.0 V VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V VCC = 5.0 V VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V CL = 15 pF CL = 50 pF TA v 85_C Min Max 20 *55_C v TA v 125_C Min Max 25 Unit ns
II I I I I I I I II III I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I I I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I IIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIII I I IIIIII I IIIIII I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIII I I IIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIII I I
19 10.5 7.5 6.5 3 100 27 20 17 10 125 35 25 21 15 155 90 35 26 20 tTLH, tTHL Output Transition Time CL = 15 pF CL = 50 pF ns 25 16 11 9 5 125 35 25 21 10 155 45 31 26 10 200 60 38 32 10 CIN Maximum Input Capacitance pF Typical @ 25_C, VCC = 5.0 V 10 CPD Power Dissipation Capacitance (Note 6) pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
MC74HC1G02
INPUT A or B 90% 50% 10% tf tr VCC GND tPLH 90% 50% 10% tTLH tTHL *Includes all probe and jig capacitance. A 1-MHz square input wave is recommended for propagation delay tests. tPHL CL* INPUT OUTPUT
OUTPUT Y
Figure 4. Switching Waveforms
Figure 5. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature Device Order Number MC74HC1G02DFT1 MC74HC1G02DFT2 MC74HC1G02DTT1 Logic Circuit Indicator MC MC MC Temp Range Identifier 74 74 74 Device Function 02 02 02 Package Suffix DF DF DT Tape and Reel Suffix T1 T2 T1 Package Type (Name/SOT#/ Common Name) SC70-5/SC-88A/ SOT-353 SC70-5/SC-88A/ SOT-353 SOT23-5/TSOP-5/ SC59-5 Tape and Reel Size 178 mm (7 in) 3000 Unit 178 mm (7 in) 3000 Unit 178 mm (7 in) 3000 Unit
Technology HC1G HC1G HC1G
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MC74HC1G02
CAVITY TAPE
TOP TAPE
TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN
COMPONENTS DIRECTION OF FEED
TAPE LEADER NO COMPONENTS 400 mm MIN
Figure 6. Tape Ends for Finished Goods
TAPE DIMENSIONS mm 2.00 4.00 4.00 1.50 TYP 1.75
8.00 $0.30
3.50 $0.50
1 1.00 MIN DIRECTION OF FEED
Figure 7. SC-70-5/SC-88A/SOT-353 DFT1 Reel Configuration/Orientation
TAPE DIMENSIONS mm 2.00
4.00 4.00 1.50 TYP 1.75
8.00 $0.30
3.50 $0.50
1 1.00 MIN DIRECTION OF FEED
Figure 8. SC-70/SC-88A/SOT-353 DFT2 and SOT23-5/TSOP-5/SC59-5 DTT1 Reel Configuration/Orientation
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MC74HC1G02
t MAX
1.5 mm MIN (0.06 in) 20.2 mm MIN (0.795 in)
13.0 mm $0.2 mm (0.512 in $0.008 in)
A
50 mm MIN (1.969 in)
FULL RADIUS
G
Figure 9. Reel Dimensions
REEL DIMENSIONS
Tape Size 8 mm T and R Suffix T1, T2 A Max 178 mm (7 in) G 8.4 mm, + 1.5 mm, -0.0 (0.33 in + 0.059 in, -0.00) t Max 14.4 mm (0.56 in)
DIRECTION OF FEED
BARCODE LABEL POCKET HOLE
Figure 10. Reel Winding Direction
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MC74HC1G02
PACKAGE DIMENSIONS
SC70-5/SC-88A/SOT-353 DF SUFFIX 5-LEAD PACKAGE CASE 419A-01 ISSUE E
A G V
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D G H J K N S V INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 0.012 0.016 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 0.30 0.40
5
4
S
1 2 3
-B-
D 5 PL
0.2 (0.008)
M
B
M
N J C
H
K
0.5 mm (min)
1.9 mm
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0.4 mm (min)
0.65 mm 0.65 mm
MC74HC1G02
PACKAGE DIMENSIONS
SOT23-5/TSOP-5/SC59-5 DT SUFFIX 5-LEAD PACKAGE CASE 483-01 ISSUE A
D
5 1 2 4 3
S
B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A B C D G H J K L M S MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.00 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181
L G A K M J
C 0.05 (0.002) H
0.037 0.95 0.074 1.9
0.037 0.95
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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0.039 1.0
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0.028 0.7 inches mm
0.094 2.4
MC74HC1G02/D


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